Power Grab N Bond - Sealant Adhesive - 290ml

Power Grab N Bond is a structural adhesive based on the same revolutionary TRIBRID Technology as CT1, but formulated with a much higher density and a "phenomenal" initial grab. It is designed to replace traditional mechanical fixings (screws and bolts) in many construction and landscaping applications. Power Grab 'n' Bond is a specialist, high-strength adhesive engineered for one specific purpose: to bond heavy objects to vertical surfaces without the need for temporary supports or "propping."

CHARACTERISTICS

• Instant "Power" Grab: The standout feature is its ability to hold heavy loads immediately. You can apply a bead of adhesive to a large stone slab or heavy mirror, press it against a vertical wall, and it will stay there without sliding or requiring timber props while it cures.
• TRIBRID Strength: It is up to 300% stronger than traditional hybrid polymers, providing a structural bond that is resistant to heavy vibrations, impacts, and thermal expansion.
• No Solvent / No Shrink: Because it is 100% solvent-free, it does not shrink during the curing process. This ensures that the bond remains exactly where you placed it, with no "pull-back" or internal stress on the materials.
• All-Weather Application: Like its sibling CT1, it can be applied to wet or dry surfaces and is fully weather-resistant, making it ideal for external cladding and landscaping

Material Compatibility

• Stone
• Granite
• Ytong
• Marble
• Concrete
• Wood
• MDF
• Fibreglass
• Glass
• Mirrors
• Polystyrene
• All metals (including alloys)
• Most plastics (except PP, PE and PTFE)

APPLICATION

• Façade & Cladding: Bonding large-format stone, ceramic, or composite panels directly to sub-frames or masonry.
• Landscaping: Securing heavy coping stones, capstones, and decorative wall features.
• Interior Fit-out: Mounting large mirrors, heavy signage, or acoustic panels where visible fixings are not desired.
  
• Heavy Construction: Bonding stainless steel plates to concrete or timber without drilling.