MITECH KO – UNIVERSAL ADHESIVE FOR FOAMED POLYSTYRENE-BASED THERMAL INSULATION SYSTEMS 25kg

PRODUCT DISCRIPTION

- high adhesion to foamed polystyrene and substrate

- for installing foamed polystyrene and immersing reinforcement mesh

- component of BSO MITECH thermal insulation system

APPLICATION

Universal MITECH KO adhesive intended for making a glass-fibre mesh reinforced layer and for foamed polystyrene boards to typical mineral substrates. Used for MITECH thermal insulation in jointless thermal insulation technology. It can be also used to level (uneven places to 5 mm) and smooth mineral substrates prior to applying paints and thin-layer plasters/renders. Contains microfibres.

Application and substrate temperature - +5°C to +25°C

Usability time - approx. 2h

Consumption when making a reinforced layer - approx. 3.5-4.0 kg/m2

Consumption when installing foamed polystyrene - approx. 4-5 kg/m2

Packaging - 25kg bags